We offer various tapes.
BG Tape
（Non-UV type BG Tape）
- 1. Fully protects the wafer surface during back grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris.
- 2. There is virtually no residual adhesive after tape is peeled off.
- 3. For cases in which slight contamination remains because of wafer surface configuration, the line-up includes a type that can be removed by cleaning with pure water.
Additionally, there is no danger of contamination from cleaning fluids because there are no water-soluble ingredients of light molecular weight in the adhesive. - 4. High precision tape thickness accuracy ensures precision wafer thickness after back grinding.
Product Information
Back Grinding
- Standard
(thickness: >75µm) - Thin Grinding
(thickness: >50µm)
