1．Stress on the wafer during peeling is reduced with the new peeling method

Using the latest heat seal peeling method, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer’s periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer. Having the new peeling method achieves a more stable peeling.

2．Back grinding tape peeling is performed without any contact with the wafer backside

By using our unique wafer holding table, back grinding tape peeling is performed without any contact with the wafer backside.

3．Adopts backside non-contact wafer handling method

By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially shaped backside used in the manufacturing processes of power devices and TSV.