1．Suitable for thin wafers

TTC system enables back grinding tape to be laminated on the wafer without applying stress. Hence, the laminator can also be used for processing thin wafers.

2．Compactly designed high performance laminator

It is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.

3．Easy-to-operate semi-automatic type

Once the wafer is set on the mounting table, the back grinding tape can be automatically laminated and cut with simple control inputs.