1．LC Tape laminator

This is an optimal system realized to meet the property of the backside coating tape (LC Tape), which is used in Flip Chip packaging.

2．High-precision tape lamination attained

By applying Lintec's unique lamination mechanism, high-precision tape lamination without voids has been achieved.

3．Internal tape pre-cutting mechanism

The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination.