We offer various equipment.
Wafer Mounter
（Fully-Automatic Vacuum Mounter）
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1．Equipped with pre-cut tape vacuum mounting function
High-precision wafer mounting is achieved for wafers with specially shaped backside that makes difficult to mount with the roller method.
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2．Performs tape mounting without contact with wafer surface
By using our unique wafer holding table, wafer mounting is performed without contact with the wafer surface.
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3．Adopts backside non-contact wafer handling mechanism
By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially formed backside used in the manufacturing processes of power devices and TSV.
Options
- Host communication function
communication format: conforms to SECS-I and HSMS/Software: conforms to GEM - Vision system
- Dicing tape
in-line pre-cutting - 300mm capability
